In a significant move, the National University of Singapore (NUS) is expanding its research team in the Electrical and Computer Engineering (ECE) Department, inviting applications for the role of Research Associate. This role is specifically tailored for professionals who are skilled in the thermal management of flexible electronics, a field that has gained significant traction in recent years due to its potential to revolutionize the electronics industry.
The chosen candidate will be entrusted with the responsibility of designing and fabricating flexible electronic devices. The primary focus will be on addressing the critical issue of overheating and improving heat dissipation in these devices. This role calls for expertise in conducting thermal simulations to identify potential thermal problems and enhance the devices’ heat dissipation capacity.
The selected Research Associate will also be expected to pioneer innovative thermal management materials, structures, and strategies to tackle overheating issues in flexible electronics. This involves exploring and assessing new materials for efficient heat transfer, storage, and dissipation in flexible electronic devices.
The role demands active collaboration with a multidisciplinary team to incorporate thermal management solutions into the overall device design and fabrication process. The Research Associate will also be required to perform experimental characterization of thermal properties and performance of flexible electronic devices using suitable measurement techniques and equipment such as IR thermal imaging and thermal reflectance system.
NUS offers a competitive salary package that is commensurate with qualifications and experience. The successful candidate will also have access to cutting-edge facilities and a stimulating research environment. The position is full-time with an initial contract duration of 12 months, which can be extended based on performance and funding availability.
The ideal candidate should meet at least four criteria from the following list:
• Hold a Master’s Degree in Electrical Engineering, Chemistry, Materials Science, or a related field with at least 2 years’ relevant work experience focusing on flexible electronics and thermal management.
• Proficiency in thermal simulation software for analyzing and optimizing thermal performance.
• Knowledge of thermal management techniques and strategies for flexible electronics, including heat dissipation mechanisms and materials.
• Experience in developing and characterizing novel materials for heat transfer, storage, and dissipation in electronic devices.
• Familiarity with experimental techniques for thermal characterization, such as thermal imaging and thermal reflectance.
• Strong problem-solving skills and ability to think critically about thermal management challenges in flexible electronics.
• Excellent written and verbal communication skills, with the ability to present research findings effectively.
This opportunity is located at the Kent Ridge Campus under the College of Design and Engineering Department. Interested candidates are encouraged to submit their application materials, including a cover letter and curriculum vitae, to [email protected]. The review of applications will commence immediately and continue until the position is filled.
The hiring move by NUS signals the growing importance of thermal management research in the field of electronics. It underscores the need for skilled professionals who can navigate the complexities of programming languages, coding, and other technical aspects to develop innovative solutions for heat-related challenges in flexible electronics. This development is expected to have significant implications for the electronics industry, particularly companies that manufacture computers and other electronic devices.